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INTERNEPCON JAPAN  East 44-31

 Automotive Electronics

Low-to-medium volume with high mix

 Electro-Mechanical Controller

Low-to-medium volume with high mix

 Audio/Video & RF

Low-to-medium volume with high mix

 

INTERNEPCON JAPAN  East 38-4

 Advanced Plating Technologies

Plating on many materials whatever you need

 

EV & HEV Drive System Technology Expo  West 7-3

 Impulse winding tester

Advanced impulse winding tester for coil partial discharge

 

PHOTONICS JAPAN  East 8-4

 TECHSPEC(R)Large Format Lenses

High Resolution Large Format Lenses, that can be used for image sensors up to 90mmL.

 TECHSPEC(R)Telecentric Lens Series

Our designed and manufactured Telecentric lenses available with a variety of types.

 TECHSPEC(R)F-Theta Scanning Lenses

Ideal for laser marking, engraving and cutting with YAG and CO2 lasers !

 TECHSPEC(R) Telecentric Backlight Illuminator

You can obtain high contrast silhouette images without using image processing softwares !

 

IC PACKAGING TECHNOLOGY EXPO  East 18-17

 

ELE TRADE 2010  East 23-18

 Universal FPC

It is FPC for the connector relay.

 Heat radiation substrate

Heat radiation substrate

 SOKUMEN PWD

SOKUMEN PWD

 Ceramic thin film substrate

It is a substrate that uses the ceramic material. It is used in an industrial each field for the high frequency module with a lot of demands. The passive element of resistance etc. can be formed in the circuit.

 

INTERNEPCON JAPAN  East 31-15

 Lead-free reflow oven

 

Int'l Automotive Electronics Technology Expo  West 2-51

 

IC PACKAGING TECHNOLOGY EXPO  East 13-8

 

ELE TRADE 2010  East 25-36

 Electronic Technology Monthly Hong Kong

The Premier Electronic Components Sourcing Guide. Circulation of 40,000 copies each months, distribution area cover China, Taiwan, Hong Kong, SouthEast Asia, Japan/Korea, India, Eastern Europe, Russia, America, and Sth America.

 

ELECTROTEST JAPAN  East 50-23

 

IC PACKAGING TECHNOLOGY EXPO  East 18-35

 Chemical process line up for LED

New Au/Ag plating process for HB LED

 Low Au content process line up

New Au/Co plating process with Ni barrier type

Co-exhibitor

TANAKA KIKINZOKU HANBAI K.K.    TANAKA KIKINZOKU KOGYO K.K.    

 

ELE TRADE 2010  East 22-7

 High Speed HDMI Cable with Ethernet

As a leader in HDMI technology, Elka's High Speed HDMI Cable with Ethernet has been certified by Panasonic ATC.

 HDMI Active Cable

-No external power required
-Suitable for type C and Type D
-Saving cost and space
-max length can up to 30 meter

 USB 3.0 Cable

 

INTERNEPCON JAPAN  East 40-31

 M1000

Set a definite length and automatically advance and cut tape

 MS1100

Set a definite length and automatically advance and cut with Safety guard

 TDA080

High production and for 80mm width

 Key Box EKB32

Number combination lock system key box

 

IC PACKAGING TECHNOLOGY EXPO  East 12-4

 Semi-auto wirebonder and auto tester

All in one machine! Correspond from Thin wire to Heavy ribbon wire, and it is possible to exchange bond head quickly. To ahievement of a bonding for power module and high freqency device, complex application.This machine has not only wirebonder, but can exchange Pull-, shearhead and if it is set pattern recognization unit (PRU), it is possible to operate as a auto-tester.

 Hybrid Full Auto Wirebonder

Correspond from tine wire to heavey ribbon wire, all kinds of device. Bonding Process Controll, Impedance Analysis, Online Pulltester, Post Bond Inspection Unit, Tool-Inspection-unit are loaded at machine, bonding quality is always controlled, it is realized a bonding of high reliability. Realization of Solar cell bonding with extended work area for environment technology.

 Manual Wirebonder

Gold ball bonder, thin (gold, aluminum)wirebonder and 53XX type(Ball bonder and Deep Access) are a suitable manual wire for investigation , development and convenience for operator. Bonding program are controlled by Windows base, with Z axis motor it allows reliable and stable bonding .

 Urltrasonic System

This TTS-030 controlls a quality of transducer and on the monitor behavior of a unvisible ultrasonic.
New product ODS 20 is not only measure of tool amplitude but allows to measure bond force and to controll record of mesure on the PC(Option). As our advantage of service we allways inspect condition of transducer for deliver of wirebonder.

Co-exhibitor

F&K DELVOTEC    F&K PHYSIKTECHNIK    

 

INTERNEPCON JAPAN  East 40-21

 Vacuum Mixing-Degassing Mixer V-mini300

A desk top model "Vacuum Degassing Mixer". most suitable for R&D and a little production.

 Vacuum Mixing-Degassing Mixer VMX-N360

Vacuum Degassing Mixer. most suitable for small production.

 Vacuum Mixing-Degassing Mixer UFO-1.5

Vacuum Degassing Mixer. most suitable for R&D and a little production.

 Vacuum Mixing-Degassing Mixer UFO-3

Vacuum Degassing Mixer. most suitable for a production line out of large scale - Middle scale.

 

PHOTONICS JAPAN  East 10-25

 

FIBER OPTICS EXPO  East 6-13

 PD Devices

Enablence offers high speed(10Gb/s, 40Gb/s) photodiodes and APD(2.5G and 10G) at the wide range of wavelength.

 VMUX

The iVMUX^TM provides a solid-state solution for multi-channel integrated VOA and wavelength multiplexer. With the automatic channel balancing function, this module allows the multiplexing of optical signals at different power levels such as those from different transmitters, line rates and protocols. This product is bidirectional and can be used as either VMUX or VDEMUX.

 ROADM

The iROAD^TM provides a flexible, integrated solution for multi-channel reconfigurable optical add/drop multiplexer (ROADM) with power monitoring and automatic channel balancing at low cost, small size and low power dissipation. The key building block for the iROADTM module is an integrated 2x1 switch-VOA-tap array based on Enablence's library of proven optical building blocks.

 Switches and VOA

Enablence's advanced switching technology use PLC to offer maximum integration in a small footprint. Only Enablence can deliver an 8x8 OXC with built-in VOA for each port on a single chip in a package slightly longer than a credit card. And no one can provide 48ch VOAs on one small chip the size of a US dime. If you cannot find the switch you need here, talk to us and we can build one that fits.

 

FIBER OPTICS EXPO  East 3-30

 

EV & HEV Drive System Technology Expo  West 5-31

 METAL SLEEVE

HYPER-THINNESS STAINLESS SLEEVE

 

INTERNEPCON JAPAN  East 32-002

 ScrewPliers

Multipurpose pliers for removing stuck screws,cutting wire

 CONDUCTIVE MAT

SUITABLE FOR WORKING BENCH TO CREATE ESD-SAFE ENVIRONMENT

 SOLID ARM TWEEZERS

2.2mm designed arms hold more than conventional tweezers..

 SOLDER SUCKER SS-02

SOLDER SUCKER MADE OF DURABLE
ALUMINUM BODY WITH SELF-CLEANING SHAFT

 

INTERNEPCON JAPAN  East 38-28

 NC Compact Milling Machine CVN-1000

 NC Compact Milling Machine CVN-2000

 

PHOTONICS JAPAN  East 11-24

 LD Direct Marker

New mode, Low cost High quality

Co-exhibitor

SHINWA CORP.    

 

FIBER OPTICS EXPO  East 4-10

 10G series

10G SR/LR/ER/ZR XFP, CWDM XFP, DWDM XFP Transceivers
XFP MSA package with duplex LC connector
Supports 9.95G to 11.1G

8G, 10G SR/LR/ER SFP+, CWDM SFP+ Transceivers
Compliant with SFF-8431, SFF-8432, DDMI available
Supports 8.5G to 10.3G
Multi-rates from 1G to 10G application available

 PON series

GEPON Transceiver
1.25G/1310nm burst-mode transmitter and 1.25G/1490nm continuous-mode receiver for ONU
1.25G/1490nm continuous-mode transmitter and 1.25G/1310nm burst-mode receiver for OLT

GPON Transceiver
1.244G/1310nm burst-mode transmitter and 2.488G/1490nm continuous-mode receiver for ONU
2.488G/1490nm continuous-mode transmitter and 1.244G/1310nm burst-mode receiver for OLT

 SFP duplex

Duplex SFP Transceiver
CWDM Duplex SFP Transceiver
DWDM Duplex SFP Transceiver
Duplex LC connector
Data rate up to 4.25G
DDMI function available
FE/GBE/FC/SDH/SONET

 SFP BIDI

Bi-Di SFP Transceiver
LC/SC connector
Data rate up to 4.25G
1310nm/1550nm,1310nm/1490nm, customized wavelengths
Distance up to 120km
DDMI function available

 

INTERNEPCON JAPAN  East 37-16

 Flap carrier system

New model!Carrier Tape

 Emboss Carrier Tape Peeling Force Tester PTS-5000

 Taping service

 

IC PACKAGING TECHNOLOGY EXPO  East 14-29

 VCO working sample chip

40 MHz~1,300 MHz

EREM  
 

INTERNEPCON JAPAN  East 30-3

 

Int'l Automotive Electronics Technology Expo  West 5-1

 

ELECTROTEST JAPAN  East 46-18

 Thermal shock chamber

High wind speed model

 Conductor resistance evaluation system

measurement of resistance changes

 Environmental stress chamber

ESPEC's Environmental Stress Chambers can withstand
up to 4500W of heat loads generated by the specimen,
improve temperature change rates, and provide expanded
ranges for temperature and humidity.

 Temperature & humidity chamber

Energy-saving chamber

 

INTERNEPCON JAPAN  East 35-28

 Swiching Power Supply

High efficiency for ecology

ETAK  
 

INTERNEPCON JAPAN  East 38-28

 electrostatic analyzer

The electrostatic analyzer measured the quantity of electric charge additionally generated though coming [no] electrification prevention evaluation thought about the generated charge and it thought only about the resistive measurement. As a result, the means with a cheap line food cost came to be taken from the viewpoint with a wide measures of the electrification prevention.

 Electrification prevention evaluation of competing goods

The comparison evaluation of the antistatic property of your product (charge leakage (surface resistance and volume resistance) and power generations) is done as the competitor goods. The comparison viewpoint is shown below.
1.Power generation material dependency (rubber, plastic, and hard chrome)
2.temmp,humidity dependency

 Consulting service(solution of static electricity troub)

Processing trouble, spreading irregularity breakdown, and dust adsorption breakdown removal of electricity defect ignition and explosion breakdowns)

 Electrostatic lecture and Electrostatic seminar

I was allowed to experience the business of all fields of electrostatic from the research on year of 35 of electricity. As a result, it is thought a theory and an actually strong engineer. Additionally, it can explain all fields the processing trouble.

ETRI  
 

Int'l Automotive Electronics Technology Expo  West 3-11

 ETRI Autoworks Tool: AUTOSAR based SW development tool

Autoworks tool provides you with a total solution for development AUTOSAR compliant SW on automotive ECUs according to methodology proposed by AUTOSAR
Autoworks tool provide you a seamless and integrated tool chain, so you can not only design SW components on automotive ECU but also configure and generate RTE and BSW related with them.

 ETRI AutoWorks Platform: Complete AUTOSAR Infrastructure

ETRICore Platform is a AUTOSAR-compliant basic software for automotive ECUs. This platform provides a basic infrastructure to assist with developing automotive software, user interfaces and management for all applications on a common hardware unit. To make a component based design possible, it uses a layered architecture that supports the decoupling of automotive hardware and system software.

 Autosar based air suspension

Driving stability and ride comfort is improved with air suspension.
It enables the continuous maintenance of vehicle height regardless of the load and number of passengers.
You can manually choose off-road driving mode and loading mode to lower the rear for convenience.
Specially it complies with AutoSAR 3.0 so you can easily add on your own functionalites.

 

Int'l Automotive Electronics Technology Expo  West 3-26

 Surface analytical service from Evans Analytical Group

We intoroduce our global analytical services focused on surface analysis and materials characterization.
Concrete analytical counseling are all welcome.

 Reliability test service from Evans Analytical Group

We introduce various reliability tests for semiconductor devices and MEMS etc.And also we itroduce IVA analysis and leak tests.

 

Advanced Electronic Materials Expo  East 21-12

 FPCB printed using Ag paste

-Reducing process and raw material fee
-No need etching process
-Can be printed pattern directly

 Printed RFID Tag

-Printing method is simple and cost efficient process
-Can be printed on paper,textile,polyester,polyimide directly

 Ag paste

-Low temperature curable and high temperature endurable paste
-High density electrode
-Low resistance electrode

 

PHOTONICS JAPAN  East 9-23

 Laser Wire Stripper Wire Master II

Virtually all wire insulation types can be removed using a CO2laser technology. Wires are easily slit using the laser. Straight, T-strip, Window slits, as well as, Spiral strips can be programmed to a controlled depth.
Our non-contact process yields the most flexible, highest quality, and most reliable laser stripping and slitting available.

 Fiber Laser Marker

Compact fiber laser marking system ideal for industrial applications and Easy Integration into any Automation System. Integrated Fiber Laser Marking Systems for all Industries - Automotive, Aerospace, Commercial, Electronic, Medical, Tools & Tooling, Packaging, and Trophies & Awards.
Automatic, Semi-Automatic, and Manual Parts Handling Systems.

 Laser Decap system

The system uses laser technology to allow an operator to remove individual layers of the mold compound all the way through the lead frames to the substrate. The operator can remove the entire compound, individual layers or sections of the mold compound. The F/A can import images from testing process such as SAM and X-RAY to show the operator exactly where the area of concern is within the sample.

 Laser Power Meter

Unique and perfect solution for a laser beam measurement!
We are committed to providing you the best NIST traceable measurements available anywhere. Furthermore, we will push the performance of our laser power meters and laser energy meters to keep pace with you as you push the performance of your lasers. Please take a moment to visit our booth and see it for yourself.

 

PHOTONICS JAPAN  East 10-30

 Nd:YVO4 Osprey series

Air cooled High Average Power & Rep.rate Laser

 Nd:YAG Harrier series

Air cooled High Energy Laser

 Integra series

Conpact body and High energy Ultra Fast system

 QMARK Series

Marking/ Engraving/Micro process system

Co-exhibitor

QUANTRONIX    

 

FIBER OPTICS EXPO  East 3-30

 

IC PACKAGING TECHNOLOGY EXPO  East 12-4

 

IC PACKAGING TECHNOLOGY EXPO  East 12-4

 

INTERNEPCON JAPAN  East 41-7

 ALL-100AX

It is a 1 -64 site universal device programmer targeting for logic IC, various MCU, NOR, NAND FLASH. By changing the module, single site programmer can be expanded to 8 sites. By connecting 8 units of 8 sites programmer, 64 sites programming is accomplished. Since full pin driver is pre-installed, user can expand from single to 8 sites. The unit can be set on auto handler for auto mass production.

 AT3-310 Auto Programming System

AT3-310 is an auto programming system with tray, tube, tape IO (any combination of IN/OUT is allowed) equipped with 4 multi nozzles. Either 4 units of ALL-100AX or FLASH-100 (32 sites programming) can be set. It accomplish 2200 UPH. 2 sets of CCD system enalbes presice positioining and adjustments. Sister system AT3-300A accomplishes 900 UPH.

 FLASH-100

High speed flash programmer FLASH-100 allows each socket to be acessed indiviusally. 8 units of 8 site programmer can be connected allowing 64 site programming. 64MB serial ROM can be programmed in 35 sec. Verify time of 1GB NAND is 53 seconds. It is an affordable fast programmer. For IC that takes less than 38 sec. for FLASH-100 to program accomplish 2200 UPH on AT3-310 auto handler.

 HL-770 Automated Tray IC Lead/Mark Inspection System

HL-770 system performs efficent and precised lead inspection, ball inspection, mark inspection and surface inspection with accurate 3D optical measurements for ICs on tray. Multi-task design eneables max. 35000 inspections per hour. Tube or tape system are also avaialbe.

 

PRINTED WIRING BOARDS EXPO  East 18-18

 

INTERNEPCON JAPAN  East 44-15

 

Int'l Automotive Electronics Technology Expo  West 1-36

 The LED image judgment checker

This system had the concept developed the picture processing that was able to be used by combining with an electric inspection as a general-purpose image inspection machine to making of LED variously though watching and the inspection with a simple sensor etc. were main currents in a past image processing system.

 

FIBER OPTICS EXPO  East 1-18

 OptoLock for plugless termination of fiber

OptoLock, a widely deployed plugless interface for Plastic Optical Fiber, enables a simple to use Fiber Optic link in consumer applications. The innovative design of OptoLock enables even the most novice consumer to quickly and easily terminate bare optical fiber. Ideal for applications with stringent quality of service requirements such as Residential gateways and IPTV-STBs.

 

ELECTROTEST JAPAN  East 48-34

 Deltascope FMP10,FMP30 / Isoscope FMP10,FMP30

 FISCHERSCOPE MMS PC

 FISCHERSCOPE X-RAY XDV-SD

 

FIBER OPTICS EXPO  East 5-12

 WDM DETECTOR

Low dark current,Low insertion loss,Wide wavelength range

 PLC SPLITTERS

Custom-defined specification,Low insertion loss,High uniformity

 Isolation Receptacle / Pigtails

Ultra high isolation,Low insertion loss

 HIGH ISOLATION WDMS

Wide bandpass,Low loss, low cross-talk,High isolation

 

Int'l Automotive Electronics Technology Expo  West 1-3

 VR-Studio(TM)

The advanced large scale VR system, built in the new architecture.

 UC-win/Road Ver.4

3-D VR software package, variety of presentations in real-time.

 UC-win/Road Experience Simulator

6 axis motion unit/Subaru Driving Simulator.

 

FIBER OPTICS EXPO  East 2-30

    
 100 Gb/s-Ethernet

In High Performance Telecom components, we focus on 10 to 100 Gbit transmission and detection optochips and OEICs. In this performance range, high quality and performance optochips are a key enabler for cost efficient optical component and modules, and thus a key success factor for our customers. We develop and fabricate 160 Gb/s Photodetector, 80 Gb/s Modulator,and 40 Gb/s Laser

 Polymer Technology

The polymers technology group develops and manufactures polymers photonic components such as planar light wave circuits (PLC) or optoelectronic integrated circuits (OEICs) according to customer specifications. This includes the Integration of alignment grooves for passive fiber coupling , Hybrid integration of detectors, Laser diode coupling, and Integration of thin film filters.

 Fiber Optic Sensors

The core skills lie in the development and production of innovative, miniaturized and fiber optic sensors and sensor networks, nanophotonic solution strategies for industrial applications in process control, process optimization for use in safety engineering, and intelligent sensorics in offshore wind energy plants and power cables.

 THz Components

HHI applies its InP-technology for developing photomixers and photoconductive antennas which convert optical signals into THz radiation. On the receiver side down conversion and highly sensitive coherent detection techniques are used. The novel InP based THz emitter and receiver chips are packaged into pigtailed modules which can be used for handheld THz sensor systems.

 

FIBER OPTICS EXPO  East 6-34

 DCM-PC

Patch Cord Integrated DCM "DCM-PC"
Low Cost
-Simple and robust design
Low IL and Negligible Latency
Channel plan independent
-Continuous compensation within target range
Small Form Factor
-No rack slot required

 Slution for IP over ATM

BIRDIE: DVB-ASI / IP Adapter and RAVEN: ASI Switch are unique solutions for IP over ATM.

Co-exhibitor

PROXIMION FIBER SYSTEMS AB    

 

INTERNEPCON JAPAN  East 52-8

 SuperNEEDLE

Range of 100,000 times flow rate tunable valve (micro L to L(Litter))

 LogMIX

Gas flow setter/mixer. adjustable concentration from ppm to % level

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