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 | | | INTERNEPCON JAPAN East 44-31 | 
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| Automotive Electronics | Low-to-medium volume with high mix | Electro-Mechanical Controller | Low-to-medium volume with high mix | Audio/Video & RF | Low-to-medium volume with high mix |
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 | | | INTERNEPCON JAPAN East 38-4 | 
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| Advanced Plating Technologies | Plating on many materials whatever you need |
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 | | | EV & HEV Drive System Technology Expo West 7-3 | 
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| Impulse winding tester | Advanced impulse winding tester for coil partial discharge |
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 | | | PHOTONICS JAPAN East 8-4 | 
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| TECHSPEC(R)Large Format Lenses | High Resolution Large Format Lenses, that can be used for image sensors up to 90mmL. | TECHSPEC(R)Telecentric Lens Series | Our designed and manufactured Telecentric lenses available with a variety of types. | TECHSPEC(R)F-Theta Scanning Lenses | Ideal for laser marking, engraving and cutting with YAG and CO2 lasers !
| TECHSPEC(R) Telecentric Backlight Illuminator | You can obtain high contrast silhouette images without using image processing softwares !
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 | | | IC PACKAGING TECHNOLOGY EXPO East 18-17 | | |
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 | | | ELE TRADE 2010 East 23-18 | | |
| Universal FPC | It is FPC for the connector relay. | Heat radiation substrate | | SOKUMEN PWD | | Ceramic thin film substrate | It is a substrate that uses the ceramic material. It is used in an industrial each field for the high frequency module with a lot of demands. The passive element of resistance etc. can be formed in the circuit. |
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 | | | INTERNEPCON JAPAN East 31-15 | 
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| Lead-free reflow oven | |
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 | | | Int'l Automotive Electronics Technology Expo West 2-51 | | |
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 | | | IC PACKAGING TECHNOLOGY EXPO East 13-8 | | |
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 | | | ELE TRADE 2010 East 25-36 | 
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| Electronic Technology Monthly Hong Kong | The Premier Electronic Components Sourcing Guide. Circulation of 40,000 copies each months, distribution area cover China, Taiwan, Hong Kong, SouthEast Asia, Japan/Korea, India, Eastern Europe, Russia, America, and Sth America. |
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 | | | ELECTROTEST JAPAN East 50-23 | | |
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 | | | IC PACKAGING TECHNOLOGY EXPO East 18-35 | 
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| Chemical process line up for LED | New Au/Ag plating process for HB LED | Low Au content process line up | New Au/Co plating process with Ni barrier type | Co-exhibitor | |
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 | | | ELE TRADE 2010 East 22-7 | 
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| High Speed HDMI Cable with Ethernet | As a leader in HDMI technology, Elka's High Speed HDMI Cable with Ethernet has been certified by Panasonic ATC. | HDMI Active Cable | -No external power required
-Suitable for type C and Type D
-Saving cost and space
-max length can up to 30 meter | USB 3.0 Cable | |
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 | | | INTERNEPCON JAPAN East 40-31 | 
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| M1000 | Set a definite length and automatically advance and cut tape | MS1100 | Set a definite length and automatically advance and cut with Safety guard | TDA080 | High production and for 80mm width | Key Box EKB32 | Number combination lock system key box |
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 | | | IC PACKAGING TECHNOLOGY EXPO East 12-4 | 
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| Semi-auto wirebonder and auto tester | All in one machine! Correspond from Thin wire to Heavy ribbon wire, and it is possible to exchange bond head quickly. To ahievement of a bonding for power module and high freqency device, complex application.This machine has not only wirebonder, but can exchange Pull-, shearhead and if it is set pattern recognization unit (PRU), it is possible to operate as a auto-tester. | Hybrid Full Auto Wirebonder | Correspond from tine wire to heavey ribbon wire, all kinds of device. Bonding Process Controll, Impedance Analysis, Online Pulltester, Post Bond Inspection Unit, Tool-Inspection-unit are loaded at machine, bonding quality is always controlled, it is realized a bonding of high reliability. Realization of Solar cell bonding with extended work area for environment technology. | Manual Wirebonder | Gold ball bonder, thin (gold, aluminum)wirebonder and 53XX type(Ball bonder and Deep Access) are a suitable manual wire for investigation , development and convenience for operator. Bonding program are controlled by Windows base, with Z axis motor it allows reliable and stable bonding .
| Urltrasonic System | This TTS-030 controlls a quality of transducer and on the monitor behavior of a unvisible ultrasonic.
New product ODS 20 is not only measure of tool amplitude but allows to measure bond force and to controll record of mesure on the PC(Option). As our advantage of service we allways inspect condition of transducer for deliver of wirebonder. | Co-exhibitor | F&K DELVOTEC F&K PHYSIKTECHNIK |
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 | | | INTERNEPCON JAPAN East 40-21 | | |
| Vacuum Mixing-Degassing Mixer V-mini300 | A desk top model "Vacuum Degassing Mixer". most suitable for R&D and a little production. | Vacuum Mixing-Degassing Mixer VMX-N360 | Vacuum Degassing Mixer. most suitable for small production. | Vacuum Mixing-Degassing Mixer UFO-1.5 | Vacuum Degassing Mixer. most suitable for R&D and a little production. | Vacuum Mixing-Degassing Mixer UFO-3 | Vacuum Degassing Mixer. most suitable for a production line out of large scale - Middle scale. |
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 | | | PHOTONICS JAPAN East 10-25 | | |
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 | | | FIBER OPTICS EXPO East 6-13 | 
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| PD Devices | Enablence offers high speed(10Gb/s, 40Gb/s) photodiodes and APD(2.5G and 10G) at the wide range of wavelength. | VMUX | The iVMUX^TM provides a solid-state solution for multi-channel integrated VOA and wavelength multiplexer. With the automatic channel balancing function, this module allows the multiplexing of optical signals at different power levels such as those from different transmitters, line rates and protocols. This product is bidirectional and can be used as either VMUX or VDEMUX. | ROADM | The iROAD^TM provides a flexible, integrated solution for multi-channel reconfigurable optical add/drop multiplexer (ROADM) with power monitoring and automatic channel balancing at low cost, small size and low power dissipation. The key building block for the iROADTM module is an integrated 2x1 switch-VOA-tap array based on Enablence's library of proven optical building blocks. | Switches and VOA | Enablence's advanced switching technology use PLC to offer maximum integration in a small footprint. Only Enablence can deliver an 8x8 OXC with built-in VOA for each port on a single chip in a package slightly longer than a credit card. And no one can provide 48ch VOAs on one small chip the size of a US dime. If you cannot find the switch you need here, talk to us and we can build one that fits. |
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 | | | FIBER OPTICS EXPO East 3-30 | | |
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 | | | EV & HEV Drive System Technology Expo West 5-31 | 
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| METAL SLEEVE | HYPER-THINNESS STAINLESS SLEEVE |
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 | | | INTERNEPCON JAPAN East 32-002 | 
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| ScrewPliers | Multipurpose pliers for removing stuck screws,cutting wire | CONDUCTIVE MAT | SUITABLE FOR WORKING BENCH TO CREATE ESD-SAFE ENVIRONMENT | SOLID ARM TWEEZERS | 2.2mm designed arms hold more than conventional tweezers.. | SOLDER SUCKER SS-02 | SOLDER SUCKER MADE OF DURABLE
ALUMINUM BODY WITH SELF-CLEANING SHAFT |
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 | | | INTERNEPCON JAPAN East 38-28 | | |
| NC Compact Milling Machine CVN-1000 | | NC Compact Milling Machine CVN-2000 | |
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 | | | PHOTONICS JAPAN East 11-24 | 
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| LD Direct Marker | New mode, Low cost High quality | Co-exhibitor | |
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 | | | FIBER OPTICS EXPO East 4-10 | 
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| 10G series | 10G SR/LR/ER/ZR XFP, CWDM XFP, DWDM XFP Transceivers
XFP MSA package with duplex LC connector
Supports 9.95G to 11.1G
8G, 10G SR/LR/ER SFP+, CWDM SFP+ Transceivers
Compliant with SFF-8431, SFF-8432, DDMI available
Supports 8.5G to 10.3G
Multi-rates from 1G to 10G application available | PON series | GEPON Transceiver
1.25G/1310nm burst-mode transmitter and 1.25G/1490nm continuous-mode receiver for ONU
1.25G/1490nm continuous-mode transmitter and 1.25G/1310nm burst-mode receiver for OLT
GPON Transceiver
1.244G/1310nm burst-mode transmitter and 2.488G/1490nm continuous-mode receiver for ONU
2.488G/1490nm continuous-mode transmitter and 1.244G/1310nm burst-mode receiver for OLT
| SFP duplex | Duplex SFP Transceiver
CWDM Duplex SFP Transceiver
DWDM Duplex SFP Transceiver
Duplex LC connector
Data rate up to 4.25G
DDMI function available
FE/GBE/FC/SDH/SONET
| SFP BIDI | Bi-Di SFP Transceiver
LC/SC connector
Data rate up to 4.25G
1310nm/1550nm,1310nm/1490nm, customized wavelengths
Distance up to 120km
DDMI function available
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 | | | INTERNEPCON JAPAN East 37-16 | | |
| Flap carrier system | | Emboss Carrier Tape Peeling Force Tester PTS-5000 | | Taping service | |
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 | | | IC PACKAGING TECHNOLOGY EXPO East 14-29 | 
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| VCO working sample chip | |
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 | | | INTERNEPCON JAPAN East 30-3 | | |
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 | | | Int'l Automotive Electronics Technology Expo West 5-1 | | |
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 | | | ELECTROTEST JAPAN East 46-18 | | |
| Thermal shock chamber | | Conductor resistance evaluation system | measurement of resistance changes | Environmental stress chamber | ESPEC's Environmental Stress Chambers can withstand
up to 4500W of heat loads generated by the specimen,
improve temperature change rates, and provide expanded
ranges for temperature and humidity. | Temperature & humidity chamber | |
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 | | | INTERNEPCON JAPAN East 35-28 | 
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| Swiching Power Supply | High efficiency for ecology |
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 | | | INTERNEPCON JAPAN East 38-28 | 
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| electrostatic analyzer | The electrostatic analyzer measured the quantity of electric charge additionally generated though coming [no] electrification prevention evaluation thought about the generated charge and it thought only about the resistive measurement. As a result, the means with a cheap line food cost came to be taken from the viewpoint with a wide measures of the electrification prevention. | Electrification prevention evaluation of competing goods | The comparison evaluation of the antistatic property of your product (charge leakage (surface resistance and volume resistance) and power generations) is done as the competitor goods. The comparison viewpoint is shown below.
1.Power generation material dependency (rubber, plastic, and hard chrome)
2.temmp,humidity dependency | Consulting service(solution of static electricity troub) | Processing trouble, spreading irregularity breakdown, and dust adsorption breakdown removal of electricity defect ignition and explosion breakdowns) | Electrostatic lecture and Electrostatic seminar | I was allowed to experience the business of all fields of electrostatic from the research on year of 35 of electricity. As a result, it is thought a theory and an actually strong engineer. Additionally, it can explain all fields the processing trouble. |
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 | | | Int'l Automotive Electronics Technology Expo West 3-11 | 
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| ETRI Autoworks Tool: AUTOSAR based SW development tool | Autoworks tool provides you with a total solution for development AUTOSAR compliant SW on automotive ECUs according to methodology proposed by AUTOSAR
Autoworks tool provide you a seamless and integrated tool chain, so you can not only design SW components on automotive ECU but also configure and generate RTE and BSW related with them. | ETRI AutoWorks Platform: Complete AUTOSAR Infrastructure | ETRICore Platform is a AUTOSAR-compliant basic software for automotive ECUs. This platform provides a basic infrastructure to assist with developing automotive software, user interfaces and management for all applications on a common hardware unit. To make a component based design possible, it uses a layered architecture that supports the decoupling of automotive hardware and system software. | Autosar based air suspension | Driving stability and ride comfort is improved with air suspension.
It enables the continuous maintenance of vehicle height regardless of the load and number of passengers.
You can manually choose off-road driving mode and loading mode to lower the rear for convenience.
Specially it complies with AutoSAR 3.0 so you can easily add on your own functionalites.
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 | | | Int'l Automotive Electronics Technology Expo West 3-26 | 
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| Surface analytical service from Evans Analytical Group | We intoroduce our global analytical services focused on surface analysis and materials characterization.
Concrete analytical counseling are all welcome. | Reliability test service from Evans Analytical Group | We introduce various reliability tests for semiconductor devices and MEMS etc.And also we itroduce IVA analysis and leak tests. |
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 | | | Advanced Electronic Materials Expo East 21-12 | 
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| FPCB printed using Ag paste | -Reducing process and raw material fee
-No need etching process
-Can be printed pattern directly | Printed RFID Tag | -Printing method is simple and cost efficient process
-Can be printed on paper,textile,polyester,polyimide directly
| Ag paste | -Low temperature curable and high temperature endurable paste
-High density electrode
-Low resistance electrode |
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 | | | PHOTONICS JAPAN East 9-23 | | |
| Laser Wire Stripper Wire Master II | Virtually all wire insulation types can be removed using a CO2laser technology. Wires are easily slit using the laser. Straight, T-strip, Window slits, as well as, Spiral strips can be programmed to a controlled depth.
Our non-contact process yields the most flexible, highest quality, and most reliable laser stripping and slitting available.
| Fiber Laser Marker | Compact fiber laser marking system ideal for industrial applications and Easy Integration into any Automation System. Integrated Fiber Laser Marking Systems for all Industries - Automotive, Aerospace, Commercial, Electronic, Medical, Tools & Tooling, Packaging, and Trophies & Awards.
Automatic, Semi-Automatic, and Manual Parts Handling Systems.
| Laser Decap system | The system uses laser technology to allow an operator to remove individual layers of the mold compound all the way through the lead frames to the substrate. The operator can remove the entire compound, individual layers or sections of the mold compound. The F/A can import images from testing process such as SAM and X-RAY to show the operator exactly where the area of concern is within the sample. | Laser Power Meter | Unique and perfect solution for a laser beam measurement!
We are committed to providing you the best NIST traceable measurements available anywhere. Furthermore, we will push the performance of our laser power meters and laser energy meters to keep pace with you as you push the performance of your lasers. Please take a moment to visit our booth and see it for yourself. |
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 | | | PHOTONICS JAPAN East 10-30 | | |
| Nd:YVO4 Osprey series | Air cooled High Average Power & Rep.rate Laser | Nd:YAG Harrier series | Air cooled High Energy Laser | Integra series | Conpact body and High energy Ultra Fast system | QMARK Series | Marking/ Engraving/Micro process system | Co-exhibitor | |
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 | | | FIBER OPTICS EXPO East 3-30 | | |
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 | | | IC PACKAGING TECHNOLOGY EXPO East 12-4 | | |
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 | | | IC PACKAGING TECHNOLOGY EXPO East 12-4 | | |
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 | | | INTERNEPCON JAPAN East 41-7 | 
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| ALL-100AX | It is a 1 -64 site universal device programmer targeting for logic IC, various MCU, NOR, NAND FLASH. By changing the module, single site programmer can be expanded to 8 sites. By connecting 8 units of 8 sites programmer, 64 sites programming is accomplished. Since full pin driver is pre-installed, user can expand from single to 8 sites. The unit can be set on auto handler for auto mass production. | AT3-310 Auto Programming System | AT3-310 is an auto programming system with tray, tube, tape IO (any combination of IN/OUT is allowed) equipped with 4 multi nozzles. Either 4 units of ALL-100AX or FLASH-100 (32 sites programming) can be set. It accomplish 2200 UPH. 2 sets of CCD system enalbes presice positioining and adjustments. Sister system AT3-300A accomplishes 900 UPH. | FLASH-100 | High speed flash programmer FLASH-100 allows each socket to be acessed indiviusally. 8 units of 8 site programmer can be connected allowing 64 site programming. 64MB serial ROM can be programmed in 35 sec. Verify time of 1GB NAND is 53 seconds. It is an affordable fast programmer. For IC that takes less than 38 sec. for FLASH-100 to program accomplish 2200 UPH on AT3-310 auto handler. | HL-770 Automated Tray IC Lead/Mark Inspection System | HL-770 system performs efficent and precised lead inspection, ball inspection, mark inspection and surface inspection with accurate 3D optical measurements for ICs on tray. Multi-task design eneables max. 35000 inspections per hour. Tube or tape system are also avaialbe. |
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 | | | PRINTED WIRING BOARDS EXPO East 18-18 | | |
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 | | | INTERNEPCON JAPAN East 44-15 | | |
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 | | | Int'l Automotive Electronics Technology Expo West 1-36 | 
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| The LED image judgment checker | This system had the concept developed the picture processing that was able to be used by combining with an electric inspection as a general-purpose image inspection machine to making of LED variously though watching and the inspection with a simple sensor etc. were main currents in a past image processing system. |
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 | | | FIBER OPTICS EXPO East 1-18 | 
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| OptoLock for plugless termination of fiber | OptoLock, a widely deployed plugless interface for Plastic Optical Fiber, enables a simple to use Fiber Optic link in consumer applications. The innovative design of OptoLock enables even the most novice consumer to quickly and easily terminate bare optical fiber. Ideal for applications with stringent quality of service requirements such as Residential gateways and IPTV-STBs. |
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 | | | ELECTROTEST JAPAN East 48-34 | | |
| Deltascope FMP10,FMP30 / Isoscope FMP10,FMP30 | | FISCHERSCOPE MMS PC | | FISCHERSCOPE X-RAY XDV-SD | |
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 | | | FIBER OPTICS EXPO East 5-12 | 
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| WDM DETECTOR | Low dark current,Low insertion loss,Wide wavelength range | PLC SPLITTERS | Custom-defined specification,Low insertion loss,High uniformity | Isolation Receptacle / Pigtails | Ultra high isolation,Low insertion loss | HIGH ISOLATION WDMS | Wide bandpass,Low loss, low cross-talk,High isolation |
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 | | | Int'l Automotive Electronics Technology Expo West 1-3 | | |
| VR-Studio(TM) | The advanced large scale VR system, built in the new architecture. | UC-win/Road Ver.4 | 3-D VR software package, variety of presentations in real-time. | UC-win/Road Experience Simulator | 6 axis motion unit/Subaru Driving Simulator. |
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 | | | FIBER OPTICS EXPO East 2-30 | 
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| 100 Gb/s-Ethernet | In High Performance Telecom components, we focus on 10 to 100 Gbit transmission and detection optochips and OEICs. In this performance range, high quality and performance optochips are a key enabler for cost efficient optical component and modules, and thus a key success factor for our customers. We develop and fabricate 160 Gb/s Photodetector, 80 Gb/s Modulator,and 40 Gb/s Laser | Polymer Technology | The polymers technology group develops and manufactures polymers photonic components such as planar light wave circuits (PLC) or optoelectronic integrated circuits (OEICs) according to customer specifications. This includes the Integration of alignment grooves for passive fiber coupling , Hybrid integration of detectors, Laser diode coupling, and Integration of thin film filters. | Fiber Optic Sensors | The core skills lie in the development and production of innovative, miniaturized and fiber optic sensors and sensor networks, nanophotonic solution strategies for industrial applications in process control, process optimization for use in safety engineering, and intelligent sensorics in offshore wind energy plants and power cables. | THz Components | HHI applies its InP-technology for developing photomixers and photoconductive antennas which convert optical signals into THz radiation. On the receiver side down conversion and highly sensitive coherent detection techniques are used. The novel InP based THz emitter and receiver chips are packaged into pigtailed modules which can be used for handheld THz sensor systems. |
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 | | | FIBER OPTICS EXPO East 6-34 | 
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| DCM-PC | Patch Cord Integrated DCM "DCM-PC"
Low Cost
-Simple and robust design
Low IL and Negligible Latency
Channel plan independent
-Continuous compensation within target range
Small Form Factor
-No rack slot required | Slution for IP over ATM | BIRDIE: DVB-ASI / IP Adapter and RAVEN: ASI Switch are unique solutions for IP over ATM. | Co-exhibitor | PROXIMION FIBER SYSTEMS AB |
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 | | | INTERNEPCON JAPAN East 52-8 | 
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| SuperNEEDLE | Range of 100,000 times flow rate tunable valve (micro L to L(Litter)) | LogMIX | Gas flow setter/mixer. adjustable concentration from ppm to % level |
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 | Copyright © by Reed Exhibitions Japan Ltd. All rights reserved. |  |
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